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Surface mounted device electronic adhesives play an important role in the mounting of circuit boards with subsequent soldering. They attach the electronic devices to the circuit board before the completed circuit boards are flipped for immersion in the soldering bath.
The adhesive is dispensed from a cartridge; this requires the adhesive to have a suitable drop profile. The drop profile of the adhesive is defined by the thixotropy, or viscosity in a resting state, and the surface tension. Both epoxy resin and acrylate-based adhesives are available for use as SMD adhesives.
The hydrophobic grades AEROSIL® R 972, AEROSIL® R 711 and AEROSIL® R 202 are very effective thixotropes for these adhesives to fulfill the demands for thixotropic flow behavior, high viscosity in resting state, high drop profile, and anti-sagging during the curing process.
Additionally, Dynasylan® GLYMO and Dynasylan® AMEO for epoxy SMD adhesives as well as Dynasylan® MEMO and Dynasylan® VTMO for acrylate-based adhesives improve the adhesion to the substrates and give better resistance to heat and moisture.
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