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Industrial adhesives for electronics and electrical engineering are used for example for bonding of loudspeakers and fixing of SMD components as well as casting of electronic parts inside a safety sensor and contacting of flip chips for smart card modules.
The adhesives are based mainly on light activated and heat curing epoxy resins as well as light-curing acrylates. The hydrophobic grade AEROSIL® R 202 is especially well suited as thixotrope for application in epoxy resins, whereas the hydrophobic grade AEROSIL® R 972 is successfully used in acrylates. Due to their fine particle sizes, AEROSIL® R 812 is especially suitable for transparent epoxy resin applications, and AEROSIL® R 106 is particularly well suited for transparent acrylate applications. High filler loading levels with low thickening and excellent mechanical properties can be obtained with AEROSIL® R 9200 and AEROSIL® R 8200, which are especially suited for casting resins. The use of AEROSIL® R 7200, in particular, makes it possible to improve specifically the mechanical properties of acrylate based systems.
Furthermore, Dynasylan® GLYMO and Dynasylan® AMEO for epoxy SMD adhesives as well as Dynasylan® MEMO and Dynasylan® VTMO for acrylate-based adhesives, improve the adhesion to the substrates and give better resistance to heat and moisture.
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